Sandoz Building Material Ltd.

 

SANDOZ GROUP has developed advanced conductive silver paste products to offer the solutions for the printed electronics market. our conductive silver pastes provide low resistance with thin film thickness based upon our core technologies, dispersing technology, printing technology and curing technology along with new development of high conductive materials.

SANDOZ silver ink series can offer variety of ways to print conductive paste for variety of applications flat screen, rotary screen, Display Touch screen etc...

Our conductive silver pastes provide low resistance with thin film thickness based upon our core technologies, dispersing technology, printing technology and curing technology along with new development of high conductive materials.

Product Application:

TSP(touch screen panel)

NFC(near field communication)

FPCB(flexible printed circuits board)

 

 

Product name Silver Paste-SAN-TP306 Silver Paste-SAN-307
Adhesion mechanism Containning PbO Glass Powder Not ContainningPbO Glass Powder
Solid contents(%) 882 882
Viscosity(cps)
Brookfield-+(spindle No.CPE51)
@25,0.4rpm
200,000~400,000 cps 200,000~400,000 cps
Curing temperature() 400~700 450~700
Resistivity(.cm) under 6 X 10-06 under 6 X 10-06
Adhesion (ASTM)) above 5B above 5B
Substrate Glass, Ceramic substrate
Printing method Screen printing(Line Resolution : above 70um)